HMS120J002D2:1200V / 2A Silicon Carbide Schottky Diode Usage Guide

The HMS120J002D2 is HeroMicro  a high-performance 1200V, 2A silicon carbide (SiC) Schottky barrier diode (SBD) in a compact TO-252-2L (DPAK) surface-mount package. As a representative wide-bandgap semiconductor device, it offers zero reverse recovery current, ultra-fast switching, low switching losses, and excellent high-temperature stability, making it ideal for small-to-medium power, high-efficiency applications such as switch-mode power supplies (SMPS), power factor correction (PFC), motor drives, and charging systems.

1. Key Specifications (from HMS120J002D2.pdf)

  • Repetitive Peak Reverse Voltage (VRRM): 1200 V

  • DC Blocking Voltage (VDC): 1200 V

  • Continuous Forward Current (IF):

    • 8.5 A (TC = 25°C)

    • 3.9 A (Tj = 135°C)

    • 2 A (Tj = 155°C, near max junction temperature)

  • Surge Forward Current (IFSM): 27 A (tp = 10 ms, half-sine)

  • Forward Voltage (VF):

    • Typ. 1.40 V (Max 1.80 V) @ IF = 2 A, Tj = 25°C

    • Typ. 2.05 V (Max 2.70 V) @ IF = 2 A, Tj = 175°C

  • Reverse Current (IR):

    • 1 μA (typ.) @ VR = 1200 V, Tj = 25°C

    • 2 μA (typ.) @ VR = 1200 V, Tj = 175°C

  • Total Capacitance (C): 140 pF @ VR = 0 V; 9.5 pF @ VR = 800 V

  • Total Capacitive Charge (QC): 12 nC @ VR = 800 V

  • Total Power Dissipation (PTOT): 52 W (TC = 25°C)

  • Thermal Resistance (Rth(j-c)): 2.9 °C/W (junction-to-case)

  • Operating Junction Temperature (Tj): –55°C to +175°C

  • Package: TO-252-2L (2-pin, SMT, tape & reel, 2500 pcs/reel)

2. Key Advantages & Usage Guidelines

(1) Zero Reverse Recovery — Ideal for High-Frequency Operation

  • As a majority-carrier device, the SiC SBD exhibits virtually zero reverse recovery current (Irr).

  • In PFC or hard-switched topologies, this reduces turn-on losses and EMI in main switches (e.g., MOSFETs)—especially beneficial at frequencies >100 kHz.

(2) Ultra-Low Leakage with Stable High-Temp Performance

  • Reverse leakage remains only ~2 μA at 175°C (max 40 μA), ensuring minimal standby loss in high-reliability, low-power systems.

(3) TO-252 Package Relies on PCB for Thermal Management

  • The TO-252 (DPAK) is a standard SMT package without an external heatsink—thermal performance depends entirely on PCB design.

  • With Rth(j-c) = 2.9 °C/W, at 2 A (VF ≈ 1.5 V, P ≈ 3 W), TJ is only ~8.7°C above TC.

  • Solder the exposed tab to a large copper pour with multiple thermal vias to inner ground planes—otherwise, continuous current capability will be severely limited.

(4) Positive Temperature Coefficient Enables Safe Paralleling

  • VF increases with temperature, allowing natural current sharing when paralleling devices—preventing thermal runaway in redundant or higher-current designs.

(5) Low Parasitic Capacitance for Cleaner Switching

  • Total capacitance is only 9.5 pF @ 800 V, with QC = 12 nC—resulting in lower displacement current and reduced voltage overshoot during fast switching, simplifying snubber design.

3. Typical Applications

Low-power PFC diode (<500 W)

Output rectifier in AC/DC adapters or LED drivers

Freewheeling/clamping diode in auxiliary or bias supplies

Control boards for small motor drives

Power stages in telecom equipment and industrial sensors

4. Summary

The HMS120J002D2 combines 1200V blocking, 2A high-temperature current rating, zero reverse recovery, ultra-low leakage, 2.9 °C/W thermal resistance, and 175°C operation into a compact, cost-effective SMD package. With proper PCB thermal layout and high-frequency optimization, it delivers exceptional efficiency, reliability, and performance in modern low-to-medium power electronics.

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