1. Device Overview
The HM210TR is a third-generation N-channel power MOSFET from HeroMicro, housed in a DPAK (TO-252) package. It features low on-resistance (RDS(on) ≤ 1.5 Ω at VGS = 10 V), fast switching performance, repetitive avalanche capability, and cost-effectiveness—making it ideal for a wide range of medium-voltage power switching applications.
2. Key Specifications
Drain-Source Voltage (VDS): 200 V
Continuous Drain Current (ID): 2.6 A (at TC = 25°C)
Pulsed Drain Current (IDM): 10 A
Maximum Power Dissipation (PD): 25 W (with heatsink, TC = 25°C); 2.5 W (PCB mount, TA = 25°C)
Total Gate Charge (Qg): 8.2 nC
Operating Junction Temperature (TJ): –55°C to +150°C
3. Application Guidelines
3.1 Thermal Management
When mounted on a 1"² FR-4 PCB, the junction-to-ambient thermal resistance (RthJA) is 50°C/W, limiting power dissipation to 2.5 W.
For higher power applications, use a heatsink or large copper pour to leverage the low junction-to-case thermal resistance (RthJC = 5.0°C/W).
3.2 Gate Drive Design
Apply a gate drive voltage of 10 V to achieve the specified low RDS(on).
The gate threshold voltage (VGS(th)) ranges from 2.0 V to 4.0 V—avoid operating near this region to minimize conduction losses.
In switching tests, a gate resistor (Rg) of 24 Ω was used. Adjusting Rg in your design allows control over dV/dt and switching speed, helping to manage EMI.
3.3 Avalanche and Body Diode Operation
The device is rated for repetitive avalanche energy (EAR = 2.5 mJ), suitable for inductive load switching.
The integrated body diode supports a continuous reverse current of 2.6 A. However, its reverse recovery time (trr) is typically 150 ns (max 310 ns), so consider recovery losses in high-frequency applications.
3.4 PCB Layout Recommendations
Minimize loop area in power traces to reduce parasitic inductance (internal LS = 7.5 nH, LD = 4.5 nH).
Use a solid ground plane and low-inductance layout to enhance robustness against high dV/dt (rated peak dV/dt = 5.0 V/ns).
4. Safe Operating Area (SOA)
Refer to Figure 8 in the datasheet for the Maximum Safe Operating Area. Ensure your operating conditions—especially during pulsed or high-voltage/high-current scenarios—remain within the SOA limits.
5. Soldering Recommendations
Peak reflow temperature should not exceed 260°C for more than 10 seconds, compliant with lead-free soldering standards.
