60V/4.5A Dual N-Channel Trench MOSFET —— HM5DN06 Usage Guide

The HM5DN06 is HeroMicro a dual N-channel MOSFET integrated into a single SOP-8 package, leveraging advanced high-cell-density trench technology. With ultra-low on-resistance, low gate charge, and fast switching, it is ideal for space-constrained applications requiring dual switches or half-bridge topologies, such as DC-DC converters, load switches, motor drivers, and portable power management.

1. Key Specifications (from HM5DN06.pdf)

  • Drain-Source Voltage (VDS): 60 V

  • Continuous Drain Current (ID): 4.5 A (TA=25°C), 3.5 A (TA=70°C)

  • Pulsed Drain Current (IDM): 18 A

  • On-Resistance (RDS(ON)):

    • Typ. 30 mΩ (Max 36 mΩ) @ VGS=10V, ID=4A

    • Typ. 34 mΩ (Max 45 mΩ) @ VGS=4.5V, ID=3A

  • Gate Threshold Voltage (VGS(th)): 1–2.5 V (@ ID=250 μA)

  • Total Gate Charge (Qg): 19 nC (@ VGS=10V, VDS=48V, ID=4A)

  • Input Capacitance (Ciss): 1020 pF (@ VDS=15V, f=1MHz)

  • Switching Characteristics (VDD=30V, ID=4A, RG=3.3Ω):

    • td(on): 3 ns, tr: 34 ns

    • td(off): 23 ns, tf: 6 ns

  • Body Diode:

    • VSD ≤ 1.2 V @ IS=1A

    • trr: 12.1 ns, Qrr: 6.7 nC

  • Single-Pulse Avalanche Energy (EAS): 22 mJ

  • Package: SOP-8 (surface-mount with exposed thermal pad)

  • Power Dissipation (PD): 1.5 W (TA=25°C)

  • Thermal Resistance: RθJA = 85 °C/W; RθJC = 25 °C/W

  • Operating Junction Temperature: –55°C to +150°C

  • Environmental: Green (lead-free) option available

2. Key Usage Guidelines

(1) Dual Independent or Half-Bridge Use

  • Contains two isolated N-MOSFETs (G1/D1/S1 and G2/D2/S2).

  • Ideal for dual load switches, half-bridge drivers (with bootstrap), or synchronous buck pairs.

  • Note: Shared package causes thermal coupling—limit total power when both channels conduct simultaneously.

(2) Logic-Level Drive Compatibility

  • Low VGS(th) (1–2.5 V) and low RDS(ON) at 4.5 V enable direct drive from 5V microcontrollers—no dedicated driver needed.

  • Ultra-fast switching (tf = 6 ns) demands short gate traces and optional 1–10 Ω gate resistor to suppress ringing.

(3) Thermal Management

  • Limited PD (1.5 W) requires careful thermal design.

  • Solder the exposed pad to a large copper area (≥2 cm²) with thermal vias.

  • Derate current above TA = 50°C per Safe Operating Area (Fig. 8).

(4) Ultra-Fast Body Diode

  • Extremely low trr (12.1 ns) and Qrr (6.7 nC) minimize recovery loss—excellent for high-frequency synchronous rectification.

(5) Safe Operating Area (SOA)

  • Narrow DC SOA (Fig. 8)—avoid linear-mode operation (e.g., constant-current loads).


  • Use 18 A IDM only under short pulses (≤300 μs, ≤2% duty).

3. Typical Applications

  • Dual 5V/12V load switches in portable devices

  • Low-power synchronous Buck converters (<20 W)

  • USB power distribution and overcurrent protection

  • Small DC fan or haptic motor H-bridge drivers

  • Battery pack charge/discharge control

4. Summary

The HM5DN06 combines dual-channel integration, ultra-low RDS(ON), 5V logic compatibility, and an ultra-fast body diode in a compact SOP-8 package. With proper PCB thermal layout and SOA compliance, it delivers high efficiency and miniaturization for consumer and industrial power applications.

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