–40V / –38A P-Channel Trench MOSFET —— STU417S Usage Guide

The STU417S is HeroMicro a high-performance P-channel power MOSFET fabricated using advanced high-cell-density trench technology. Designed for high-efficiency, high-current switching applications, it features –40V blocking voltage, –38A continuous drain current, ultra-low on-resistance (<20 mΩ @ VGS=–10V), and low gate charge, making it ideal for battery protection, high-side load switches, motor control, inverters, and industrial systems.

1. Key Specifications (from STU417S.pdf)

  • Drain-Source Voltage (VDS): –40 V

  • Continuous Drain Current (ID):

    • –38 A (TC = 25°C)

    • –27 A (TC = 100°C, derated)

  • Pulsed Drain Current (IDM): –150 A (limited by SOA)

  • On-Resistance RDS(ON):

    • <20 mΩ (typ.) @ VGS = –10 V, ID = –8 A

  • Gate Threshold Voltage (VGS(th)): –1 to –2.5 V (@ ID = –250 μA)

  • Total Gate Charge (Qg): 13 nC (typ.) @ VGS=–10V, VDS=–20V, ID=–8A

  • Body Diode Forward Voltage (VSD): ≤ –1.2 V @ IS = –10 A

  • Power Dissipation (PD):

    • 63 W (TC = 25°C)

    • 32 W (TC = 100°C)

  • Thermal Resistance (RθJC): 2.38 °C/W (junction-to-case)

  • Operating Junction Temperature (TJ): –55°C to +175°C (industry-leading)

  • Package: Pinout labeled DSG; likely TO-220AB, D²PAK, or similar power package

2. Key Usage Guidelines

(1) Ideal for High-Side Switching

  • P-channel MOSFETs are naturally suited for high-side switch configurations (source to V+, drain to load), eliminating the need for bootstrap circuits.

  • Turn on when VGS ≤ –|VGS(th)| (typically ≤ –2.5 V); full enhancement requires VGS = –10 V.

(2) Good Logic-Level Compatibility

  • Ultra-low RDS(ON) at VGS = –10 V ensures minimal conduction loss. Even at VGS = –4.5 V (common in 5V systems), performance remains acceptable.

  • Use an NPN transistor or dedicated driver IC to interface 3.3V/5V logic signals to the high-side gate.

(3) Exceptional High-Temperature Capability

  • +175°C maximum junction temperature enables reliable operation in harsh environments such as automotive under-hood or sealed industrial enclosures.

(4) Thermal Design Is Critical

  • At –38 A, power dissipation can reach:

    P=I2⋅RDS(ON)=(38)2×0.02≈28.9 W

  • With RθJC = 2.38 °C/W and TC = 25°C, TJ ≈ 25 + 28.9 × 2.38 ≈ 94°C—within safe limits.

  • Must be mounted on an adequate heatsink with proper thermal interface material for sustained high-current operation.

(5) Body Diode for Freewheeling

  • Built-in body diode (VSD ≤ –1.2 V @ –10 A) provides a path for inductive kickback from relays or motors. Reverse recovery characteristics are not specified—use caution in high-frequency switching.

(6) Respect Absolute Maximum Ratings

  • Do not exceed –40 V VDS (including transients).

  • –150 A IDM is for short pulses only (microseconds)—not for continuous overload.

3. Typical Applications

  • High-side protection switch in Li-ion battery packs

  • Main power disconnect in automotive electronics

  • High-side load driver in industrial PLC output modules

  • Redundant power path selector in server/telecom PSUs

  • DC-link switch in inverters or UPS systems

4. Summary

The STU417S stands out with its –40V/–38A rating, <20 mΩ ultra-low RDS(ON), 13 nC low Qg, industry-leading +175°C junction temperature, and excellent 2.38 °C/W thermal resistance. When implemented with proper gate driving, robust thermal management, and protection circuitry, it delivers a highly efficient, compact, and reliable solution for demanding high-side switching applications.

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