The HRT60P18D is HeroMicro a high-performance P-channel MOSFET that leverages advanced trench technology and high cell density design to deliver ultra-low on-resistance (RDS(ON)) and excellent thermal performance, making it ideal for a wide range of power management and switching applications.
1. Key Specifications
Drain-Source Voltage (VDS): -60 V
Continuous Drain Current (ID): -30 A (at TC = 25°C), -23.5 A (at TC = 100°C)
On-Resistance (RDS(ON)):
@ VGS = -10 V, ID = -15 A: Typical 24 mΩ, Max 29 mΩ
@ VGS = -4.5 V, ID = -10 A: Typical 30.4 mΩ, Max 39 mΩ
Total Gate Charge (Qg): 53 nC (at VGS = -10 V, VDS = -30 V)
Package: TO-252 (DPAK), optimized for efficient heat dissipation
Operating Junction Temperature Range: -55°C to +175°C
2. Typical Applications
Power switching (e.g., DC-DC converters, load switches)
Battery Management Systems (BMS)
Motor control and driving circuits
High-side switching in industrial automation
3. Design Considerations
Gate Drive Voltage: For minimal conduction loss, drive the gate with VGS ≤ -10 V. Logic-level operation (e.g., -4.5 V) is possible but results in slightly higher RDS(ON).
Thermal Management: Although the maximum power dissipation is 79 W, real-world designs must ensure the junction temperature stays below 175°C. With a junction-to-case thermal resistance (RθJC) of 1.9°C/W, use a large copper area or heatsink on the PCB.
Avalanche Capability: The single-pulse avalanche energy (EAS) is 196 mJ, suitable for inductive load switching. Avoid repetitive avalanche events to prevent device degradation.
Body Diode Performance: The intrinsic body diode has a typical forward voltage (VSD) of -0.88 V at IS = -15 A and a reverse recovery time (trr) of 26 ns—useful for freewheeling, but consider recovery losses in high-frequency applications.
4. Layout and Driving Recommendations
Keep the gate drive loop as short as possible to minimize parasitic inductance and prevent ringing.
A gate resistor (RGEN) of around 3 Ω helps balance switching speed and EMI.
Ensure the TO-252 package’s thermal pad is well-connected to a ground or thermal plane for optimal heat spreading.
